Subject: Topic: PRICE_SCHED

From: The MOSIS System <[email-masked]> (send requests to [email-masked])
Date: 22 September 1992 16:07:36

Your-message-sent: 22 Sep 1992 17:39:40 -0500 (CDT)
Your-Message-ID: <[email-masked]>
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MOSIS-Reply-Posted-for-Delivery: 22 September 1992 16:07:36

                             MOSIS PRICE LIST

Dear MOSIS User:

Here are the MOSIS prices from July 1 through December 31, 1992.  If
you have any questions about these prices please contact Kathleen Fry
at <[email-masked]> or (310) 822-1511 or FAX her at (310) 823-5624.

The last page of this document contains information on placing an order,
project size, assembly, additional parts and production orders.

 -----------------------------------------------------------------------------
 | NOTE: The prices below are presented in three columns.  The STANDARD	     |
 | PRICE, in the leftmost column, is available to anyone.                    |
 |                                                                           |
 | The DISCOUNT PRICE in the middle column is available to Universities,     |
 | Government Agencies and Organizations ordering work that will be charged  |
 | to a government contract.  To qualify for the government contract dis-    |
 | count, you must include the following information on your purchase order: |
 | (1) funding agency; (2) contract number; (3) government program manager;  |
 | and (4) contract expiration date.                                         |
 |                                                                           |
 | The DARPA/NSF PRICE in the far right column is reserved for projects that |
 | are submitted under DARPA or NSF sponsored MOSIS accounts.  No purchase   |
 | order is required for these projects.                                     |
 -----------------------------------------------------------------------------

2.0 MICRON CMOS TECHNOLOGY (Priced per project, includes packaging)
==============================================================================
PART #   MAXIMUM PROJECT SIZE         UNIT      STANDARD   DISCOUNT  DARPA/NSF
                                                 PRICE      PRICE      PRICE
==============================================================================
10011    2.22 x 2.25 mm (TinyChip)  lot of  4      $520       $480       $450
         Additional Quantities      lot of  4      $520       $480       $450

10007    4.6 x 6.8 mm               lot of 12    $2,600     $2,410     $2,230
10008    Additional Quantities      lot of  8    $1,690     $1,560     $1,440

10003    6.9 x 6.8 mm               lot of 24    $6,150     $5,690     $5,050
10004    Additional Quantities      lot of  8    $2,030     $1,880     $1,660

10001    7.9 x 9.2 mm               lot of 32   $11,900    $11,010    $10,340
10002    Additional Quantities      lot of  8    $2,960     $2,740     $2,570
==============================================================================

OTHER TECHNOLOGIES (priced per sq mm, does NOT include packaging)

The minimum charge is based on the smallest frame size distributed by MOSIS
for these processes, 1.94mm x 1.94mm.  Please do your calculation in microns,
converting the result into square millimeters carried out to three decimal
places.  The price should be rounded to the nearest dollar.  For example,
a sample minimum charge calculation for a 1.2 micron project is:

(1.94mm) * (1.94mm) = 3.764 sq.mm.; [(3.764 sq.mm)*($450/sq.mm)] = $1,694.

Note that any packaging charges would be added to this basic figure (see
packaging costs below).

===============================================================================
PART #   MAXIMUM PROJECT SIZE         UNIT       STANDARD   DISCOUNT  DARPA/NFS
                                                  PRICE      PRICE      PRICE
===============================================================================
10100    1.2 micron CMOS (24 parts)   sq mm        $450       $420       $330

10101    0.8 micron CMOS (24 parts)   sq mm        $550       $510       $480

10102    HGaAs3 (24 parts)            sq mm        $530       $490       $450

10103	 1.2 micron CMOS              Lot of     $4,370     $4,180     $3,800
	 (additional parts)             24

10104	 0.8 micron CMOS	      Lot of     $7,590     $7,260     $6,600
	 (additional parts)             24

PACKAGING PRICES FOR 1.2 AND 0.8 CIRCUITS
===============================================================================
PART #        PACKAGE                 UNIT       STANDARD   DISCOUNT  DARPA/NFS
                                                  PRICE      PRICE      PRICE
===============================================================================
DIP28         28-pin DIP              each          $20        $19        $13
DIP40         40-pin DIP              each          $20        $19        $13
PGA65         65-pin PGA              each          $40        $37        $26
PGA84         84-pin PGA              each          $40        $37        $26
PGA108       108-pin PGA              each          $40        $37        $26
PGA132       132-pin PGA              each          $50        $46        $40

PACKAGING PRICES FOR GAAS CIRCUITS
===============================================================================
PART #        PACKAGE                 UNIT       STANDARD   DISCOUNT  DARPA/NFS
                                                  PRICE      PRICE      PRICE
===============================================================================
LDCC28        28-LDCC                 each          $60        $56        $48
LDCC52        52-LDCC                 each          $60        $56        $48
LDCC132      132-LDCC                 each         $100        $93        $91
PGA149       149-PGA                  each         $100        $93        $91
LDCC164      164-LDCC                 each         $150       $139       $132
PGA211       211-PGA                  each         $150       $139       $132
LDCC256      256-LDCC                 each         $250       $231       $225
LDCC344      344-LDCC                 each         $250       $231       $225

MISCELLANEOUS PACKAGING:
===============================================================================
PART #        PACKAGE                 UNIT       STANDARD   DISCOUNT  DARPA/NFS
                                                  PRICE      PRICE      PRICE
===============================================================================
CUSTDIP      Customer-supplied DIP    each          $20        $19         $7

CUSTPGA      Customer-supplied PGA    each          $40        $37        $24



PLACING AN ORDER: (Commercial Accounts)

The first time you place an order with MOSIS, please fill out two copies of
our customer agreement (copies available from MOSIS).  BOTH copies of the
agreement should be signed by your authorized representative and returned to
us.  We will sign them and return one signed original to you.

MOSIS must have a hardcopy purchase order before proceeding with fabrication.
Please send the purchase order to: KEVIN STEPHENS, THE MOSIS SERVICE,
USC/ INFORMATION SCIENCES INSTITUTE, 4676 ADMIRALTY WAY, MARINA DEL
REY, CA 90292-6695. Payment terms are net 30 days; prices include shipping 
costs. PLEASE NOTE: Packaged parts will be sent to the shipping address listed
on the purchase order.  Please make sure the shipping address on the purchase
order is correct.

MOSIS accepts designs in CIF, GDS II and MEBES format.  You may send your
layout geometry by electronic mail (instructions are outlined in the MOSIS
User Manual), or by offline media via regular mail, which must be accompanied
by a completed MOSIS Project Submission Form (available from MOSIS).  Send
media and accompanying paperwork to SAM REYNOLDS, THE MOSIS SERVICE,
USC/INFORMATION SCIENCES INSTITUTE, 4676 ADMIRALTY WAY, MARINA DEL REY, CA
90292-6695. Offline designs must be received by MOSIS at least 48 hours before
a run is scheduled to begin.

PLACING AN ORDER: (DARPA and NSF Sponsored Accounts)

If your MOSIS account is sponsored by NSF, your designs must be sent to MOSIS
via electronic mail.  (This is the recommended method for DARPA accounts, as
well.)  If you wish to send your design via offline media, it must be
authorized in advance by DARPA or NSF.  Offline media must be accompanied by
a completed MOSIS Project Submission Form (available from MOSIS). Send media
and accompanying paperwork to SAM REYNOLDS, THE MOSIS SERVICE,
USC/INFORMATION SCIENCES INSTITUTE, 4676 ADMIRALTY WAY, MARINA DEL REY,
CA 90292-6695.  Designs must be received by MOSIS at least 48 hours before a
run is scheduled to begin.

PROJECT SIZE:

MOSIS adds Scribe lanes and other overhead to the submitted geometry. Please
do not include these items in your design.  Your die size will be determined 
by MOSIS to fit both your packaging needs and our wafer packing requirements.
If the exact die size is critical for your application, please contact Sam
Reynolds at (310) 822-1511.

ASSEMBLY:                                              
                                                                          
MOSIS offers ceramic DIP, PGA and LDCC packages in a variety of sizes (see
Packaging Prices above).  You may also supply your own packages or request
that your parts be unpackaged.  Lids on all projects will be taped unless you
request hermetic sealing.  TinyChip die are limited to the 28 and 40 pin DIPS;
MOSIS will  do a bondability check on TinyChip  projects to 1) confirm that
the number of pads is 40 or less, and 2) make sure a bonding diagram can be
generated automatically by MOSIS.  NOTE TO ONLINE USERS:  When submitting
TinyChip projects, remember to use the 'TINY-' prefix, i.e., 'TINY-SCN'.

If the pin count or performance of the packages stocked by MOSIS is inadequate
for your application, please call Wes Hansford at (310) 822-1511 to discuss
your special requirements. Our vendors stock a large variety of packages
for high performance and high pin-out applications.

	******************************************************************
	If you provide a custom bonding diagram, it MUST ACCOMPANY your
	Project Submission Form (offline users) or it MUST BE RECEIVED
	by Sam Reynolds BEFORE the scheduled run-closing date (online
	users).  FAILURE TO DO THIS MAY RESULT IN UNPACKAGED PARTS.

	If you supply your own packages, they MUST BE RECEIVED by Friday
	of the scheduled run-closing week.  REMEMBER to send package lids.
	FAILURE TO DO THIS MAY RESULT IN UNPACKAGED PARTS.
	******************************************************************

2.0 MICRON TECHNOLOGIES:  The total price for these projects includes
packaging.  You may request unpackaged parts or provide your own packages;
however, the price does not change for these options.

0.8, 1.2 MICRON AND GAAS TECHNOLOGIES: The price per square millimeter for
these projects does NOT include packaging costs, which are determined 
according to the number of pins in the package.  See the price schedules
above for the current costs for the various types of packages.

ADDITIONAL PARTS AND PRODUCTION ORDERS:
If you wish to order more than the minimum quantity of parts, please
request the desired additional parts in your initial order.  For 2.0
micron technologies, extra parts must be ordered in lots of eight,
except for TinyChips which must be ordered in lots of four.  Larger
quantities of 0.8, 1.2 and GaAs3 technologies must be ordered in lots
of 24.

To place an order for an entire wafer lot of any technology, please
contact Kathleen Fry at (310) 822-1511;  jobs will be quoted on an
individual basis.      

ADDITIONAL INFORMATION:                                                     
                                                                            
For further information, contact the following MOSIS staff at               
(310) 822-1511 or by network mail, or via FAX at (310) 823-5624.

 Order Information:        Kevin Stephens          [email-masked]  
                           (or Gwen Ganger)

 General  Information:     Sam Reynolds            [email-masked]   
                           (or Wayne Tanner)
                                              
 Documentation Requests:   Wayne Tanner            [email-masked]  
                           (or Sam Reynolds)